How to change component temperature of system for Windchill Quality Solution 11 to calculate MTBF?
You can set the temperature for the system level temperature by selecting the top level assembly in the System Tree, and setting the Temperature on the Calculation Data tab. The temperature that you set at this level will be used for all lower level parts and assemblies unless it is overridden at a lower level.
You can apply a different temperature to any lower level assembly by selecting that assembly and applying a different temperature on the Calculation Data tab for that assembly. If the temperature on the Calculation data tab shows #.# then it is using the temperate from the next higher level.
For any component you can adjust the temperature used for the calculation by applying a Temperature Rise or a Temp Override on the Prediction Data tab for the selected part. A value entered in the Temperature Rise field will be added to the next higher assembly temperature, and a Temp Override will be used in place of the next higher assembly temperature.
What 's a difference between Temperature Rise and temp Override?
If we have assembly temperature measurements data, we should fill in that temperature Rise or temp override.
If you enter a value in Temperature Rise, that value will be added to the next higher level assembly temperature and the sum total will be used in the calculation of the PiT factor. If you choose to graph failure rate vs. temperature, the temperature of this component will vary with temperature - and thus the failure rate will adjust across the temperature as well.
If you enter a value in the Temp Override field it uses that temperature to calculate PiT regardless of the temperature at the next higher level assembly or the value in the Temperature Rise field. If you choose to graph failure rate vs. temperature, the temperature of this component will not vary, and thus the failure rate will be constant for all temperatures.
In temperature rise,value will be added to next higher level while in choosing graphic failure rate vs temperature,temperature of this component varies..So it affects failure rate directly